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PROCESSORS

AMD Ryzen 9 7900X3D

Boxed, no cooler · part 100-100000909WOF

CPU cores
12
Thread count
24
Maximum boost clock
5.6 GHz

A 12-core, 24-thread Zen 4 processor for AM5 with AMD 3D V-Cache, giving 128 MB of L3 cache in total, plus up to 5.6 GHz boost and a 120 W default TDP. It includes basic Radeon graphics; the boxed version has no cooler.

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Price history · US
eBay USnew · USD

Item price · same listing and exact model

Latest check$499.95
Lowest shown$475.95

24 observed days · 24 Sept–17 Oct

eBay US observed item prices24 observed days. Last checked price per UTC day. Missing dates break the line. Use Explore dates or the table for exact values.
$499.9517 Oct, 12:01 UTC

Last recorded item price per UTC day. Delivery and tax are excluded. Gaps mean no recorded check. Past prices do not confirm current availability; this is not a market-wide price history.

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Exact listing · eBay US · USD
Checked (UTC)Item price
$527.28
$527.22
$553.31
$662.26
$662.26
$662.26
$662.26
$636.36
$635.78
$635.68
$610.48
$581.41
$476.08
$476.02
$476.02
$476.02
$475.95
$499.95
$499.95
$499.95
$499.95
$499.95
$499.95
$499.95

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THE ACTUAL PRODUCT
AMD's official boxed-product artwork associated with Ryzen 9 7900X3D on its exact manufacturer product page; the visible artwork identifies the family rather than a readable exact model number.
Official product image · Image source detailsProduct imagery does not establish a retailer’s bundle or condition.
Compare with AMD Ryzen 9 9900X3D
Explore alternativesUpgrade from this product

Specifications checked 12 Sept 2026Manufacturer specifications, not a hands-on test.

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Explore all alternatives

The nearest checked processors by key specifications, with what differs from the AMD Ryzen 9 7900X3D. The first matches the Compare button above.

The useful part.

Key strengths

12 Zen 4 cores and 24 threads with up to 5.6 GHz boost and 128 MB of L3 cache using AMD 3D V-Cache.

Manufacturer source

Supports EXPO memory profiles, Precision Boost Overdrive and Curve Optimizer, plus PCIe 5.0 (24 usable lanes) and ECC memory on compatible motherboards.

Manufacturer source
The checks that matter.

Before you buy

No cooler in the box, and AMD recommends liquid cooling for best performance.

Manufacturer source

Needs an AM5 motherboard whose BIOS supports this processor, plus DDR5 memory; memory is rated at DDR5-5200 with two sticks but only DDR5-3600 with four.

Manufacturer source

AMD doesn't list unlocked CPU-multiplier overclocking for this model; tuning is through PBO, Curve Optimizer and EXPO. Its maximum operating temperature is 89°C.

Manufacturer source
Build around it.

Works with

Products in this catalogue that list the same socket or memory type as the AMD Ryzen 9 7900X3D. A shared socket or memory type is necessary but not sufficient: check the exact CPU and memory support lists, and the BIOS version, before buying.

Start a build with thisOpens My setups with the AMD Ryzen 9 7900X3D in place and checks each part you add
Every specification. With its source.

Full specifications

Suggest a correctionOur publishing standard

Exact configuration: AM5 boxed processor 100-100000909WOF · cooler not included

38 specifications in 9 groups. Values are manufacturer specifications unless a row says “Measured result” or “Calculated from cited specifications”. 3 rows repeat listed facts in the manufacturer’s own wording, kept under “Manufacturer wording”.

Cores & clocks

7 items
CPU cores
12Source
Thread count
24Source
Maximum boost clock
5.6 GHz

Peak boost clock, not a sustained all-core speed.

Source
Base clock
4.4 GHz

AMD's base frequency, not a guaranteed all-core speed under every workload.

Source
CPU architecture
Zen 4

AMD's CPU core architecture.

Source
CPU and memory tuning
EXPO, PBO and Curve Optimizer

AMD lists EXPO memory profiles, Precision Boost Overdrive, Curve Optimizer and Ryzen Master support. Its specification page doesn't list unlocked CPU-multiplier overclocking for this model.

Source
CPU boost technology
Precision Boost 2

Automatic boost, separate from Precision Boost Overdrive and manual overclocking. Clocks vary with workload, cooling and power.

Source
Manufacturer wording (2)

The same facts in the manufacturer’s combined or original wording, each with its source.

Core count and architecture
12 cores · Zen 4

Manufacturer core count and architecture, not an application-performance ranking.

Source
Base / boost clocks and conditions
4.4 GHz base; up to 5.6 GHz boost

Maximum boost is not a sustained all-core frequency. Workload, cooling and firmware affect clocks.

Source

Cache

4 items
L3 cache
128 MB

Total L3 cache across the processor.

Source
L2 cache
12 MBSource
L1 cache
768 KB

Total L1 cache across all cores.

Source
3D V-Cache design
3D V-Cache

AMD lists 3D V-Cache for this model; it doesn't say how the cache is shared between the core chiplets.

Source

Power & temperature

2 items
Default TDP
120 W

Default TDP, not measured system power.

Source
Maximum junction temperature
89 °C

AMD's maximum operating temperature (Tjmax), not a typical running temperature.

Source
Manufacturer wording (1)

The same facts in the manufacturer’s combined or original wording, each with its source.

Processor power definitions
120 W default TDP

AMD's thermal design rating, not the power the whole system will draw.

Source

Memory support

6 items
Memory support
Dual-channel DDR5 UDIMM; up to 128 GB; DDR5-5200 with two DIMMs or DDR5-3600 with four

AMD rates two DIMMs (single- or dual-rank) at DDR5-5200 and four at DDR5-3600. Check the motherboard's memory support list; EXPO speeds aren't guaranteed.

Source
Maximum supported memory
128 GB

AMD's CPU limit; the motherboard, its BIOS and the memory kit must also support this capacity.

Source
Memory ceiling with two DIMMs
5200 MT/s

Applies to two single-rank or two dual-rank DDR5 modules. EXPO memory overclocking is separate and depends on the motherboard.

Source
Memory ceiling with four DIMMs
3600 MT/s

Applies to four single-rank or four dual-rank DDR5 modules; slower than the two-module rating.

Source
CPU ECC memory capability
Yes

Needs a motherboard and memory that support ECC.

Source
Memory channels
2

Memory channels in the processor, not the number of motherboard DIMM slots.

Source

Graphics, display & AI

4 items
Integrated graphics or none
AMD Radeon Graphics · 2 graphics cores · 2200 MHz

Manufacturer graphics configuration, not a measured gaming result. Display outputs depend on the motherboard.

Source
USB-C DisplayPort Alternate Mode capability
Yes

Needs a motherboard USB-C port wired for display output.

Source
Integrated graphics cores
2

Graphics cores in the built-in Radeon graphics.

Source
Integrated graphics frequency
2200 MHz

Built-in graphics clock; display outputs depend on the motherboard.

Source

PCIe, USB & storage

3 items
Native PCIe
PCIe 5.0 · 28 total / 24 usable lanes

Native CPU version and lane totals, not graphics-slot width or motherboard slot count. Actual links depend on the motherboard and installed devices.

Source
CPU-native USB capability
4 USB 10 Gb/s ports; 1 USB 2.0 port

USB provided by the processor itself; the motherboard decides which ports, including any USB4, are actually fitted.

Source
Platform NVMe modes
Boot; RAID 0, 1 and 10

The motherboard, drivers and drives must also support these modes, and some boards offer fewer.

Source

Platform & package

6 items
Socket
AM5Source
Cooling
Cooler required separately; AMD recommends liquid cooling for optimal performance

AMD doesn't include a cooler with this boxed version; choose one that fits AM5 and the motherboard.

Source
Platform checks
Supported AM5 motherboard and DDR5 memory required. Check the motherboard CPU-support list and BIOS before purchase.Source
Listed supporting chipsets
A620, X670E, X670, B650E, B650, X870E, X870, B840, B850

Chipset families AMD lists; check the motherboard's CPU-support list and BIOS version.

Source
Manufacturer launch date
2023-02-28

AMD's launch date, not a sign of current stock.

Source
Specification market
Global

AMD lists global availability; UK and US stock, box contents and warranty can still vary by seller.

Source

Features & security

1 item
Listed instruction capabilities
x86-64; AVX-512, AVX2, AVX, AES, AMD-V, FMA3, SHA and SSE extensions

Software and firmware must support these instruction sets.

Source

Manufacturing

5 items
CPU-core manufacturing process
TSMC 5nm FinFET

Manufacturing process for the CPU cores.

Source
I/O-die manufacturing process
TSMC 6nm FinFET

Manufacturing process for the separate I/O die.

Source
Package die count
3

Number of dies in the processor package; not all of them contain CPU cores.

Source
CPU compute die area
71 mm²

Size of each CPU compute die.

Source
I/O die area
122 mm²

Size of the I/O die.

Source
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