AMD Ryzen 9 5950XAM4 boxed processor 100-100000059WOF · cooler not included- Maximum boost clock
- 4.9 GHzThis one: 4.8 GHz
- Base clock
- 3.4 GHzThis one: 3.3 GHz
Boxed, no cooler · part 100-100001581WOF
A 16-core, 32-thread Zen 3 processor for AM4 with up to 4.8 GHz boost, 64 MB of L3 cache and a 105 W TDP. Despite the similar name, it has four more cores than the 12-core 5900X. The boxed version has no cooler or integrated graphics.

Specifications checked 12 Sept 2026Manufacturer specifications, not a hands-on test.
16 Zen 3 cores and 32 threads with up to 4.8 GHz boost and 64 MB of L3 cache; supports up to 128 GB of DDR4, ECC on compatible motherboards and unlocked overclocking.
Its 3.3 GHz base clock is lower than the 12-core 5900X's 3.7 GHz; both boost up to 4.8 GHz.
Memory speed depends on how many sticks you fit: DDR4-3200 with two, DDR4-2933 with four single-rank and DDR4-2667 with four dual-rank. It also needs an AM4 motherboard with a compatible BIOS, a separate cooler and a graphics card.
Products in this catalogue that list the same socket or memory type as the AMD Ryzen 9 5900XT. A shared socket or memory type is necessary but not sufficient: check the exact CPU and memory support lists, and the BIOS version, before buying.
Exact configuration: AM4 boxed processor 100-100001581WOF · cooler not included
39 specifications in 9 groups. Values are manufacturer specifications unless a row says “Measured result” or “Calculated from cited specifications”. 3 rows repeat listed facts in the manufacturer’s own wording, kept under “Manufacturer wording”.
Peak boost clock, not a sustained all-core speed.
SourceBase frequency; boost clocks are listed separately.
SourceAMD's CPU core architecture.
SourceAMD lists the CPU as unlocked for overclocking; the motherboard and firmware must support it, and results aren't guaranteed.
SourceAMD lists the CPU as unlocked for overclocking and supported by Ryzen Master. Results depend on the motherboard, cooling and the individual chip.
SourceAutomatic boost, separate from PBO and manual CPU tuning.
SourceThe same facts in the manufacturer’s combined or original wording, each with its source.
Default TDP, not measured system power.
SourceAMD's maximum operating temperature (Tjmax), not a typical running temperature.
SourceThe same facts in the manufacturer’s combined or original wording, each with its source.
AMD's thermal design rating, not the power the whole system will draw.
SourceAMD rates two DIMMs at DDR4-3200, four single-rank DIMMs at DDR4-2933 and four dual-rank DIMMs at DDR4-2667, up to 128 GB over two channels. Check the motherboard's CPU-support list and BIOS.
SourceAMD's CPU limit; the motherboard, its BIOS and the memory kit must also support this capacity.
SourceAMD lists ECC support; the motherboard, BIOS and memory must also support ECC.
SourceMemory channels in the processor, not the number of motherboard DIMM slots.
SourceApplies to two single- or dual-rank DDR4 modules; XMP speeds aren't guaranteed.
SourceFour single-rank DDR4 modules have a lower rated speed than two.
SourceFour dual-rank DDR4 modules have the lowest rated speed.
SourceCPU PCIe version, not the number of motherboard slots or a guarantee of the board's bandwidth.
SourceLanes provided by the CPU; chipset lanes and board slots are separate.
SourcePorts provided by the processor itself; the motherboard's chipset and controllers decide the ports on the board.
SourceSATA ports provided by the CPU; the motherboard decides how many are fitted.
SourceExtra usable lanes from the chipset, on top of the CPU's 24 total / 20 usable lanes. Slots and lane sharing depend on the motherboard.
SourceRAID modes need compatible motherboard firmware and drives.
SourceApplies to the boxed version listed here.
SourceAMD's specification applies globally; UK and US stock, warranty and sellers can still vary.
SourceChipset families AMD lists; check the motherboard's CPU-support list and BIOS version.
SourceAMD lists SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A and SSSE3; AVX-512 is not listed.
SourceManufacturing process for the CPU cores.
SourceManufacturing process for the separate I/O die.
SourceSize of one CPU compute die.
SourceSize of the I/O die.
SourceNumber of dies in the processor package, not the core count.
SourceMore of the nearest checked processors by key specifications, for a side-by-side comparison.
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